AlN semiconductor submount
Description
Trusee can provides ceramic heat sink with high thermal conductivity, to provide solutions for heat dissipation of high power semiconductor laser diode, electrode connection, solder preset and assembly positioning.
- Substrate：AlN、BeO、SiC etc
- Dimension：customizable
- Metallization：Cu/Ni/Au, Cu thickness 75μm ± 15 μm，other layer customizable
- AuSn layer：Au(75±5wt%)Sn，customizable
- Graphic accuracy：±30 μm
|
Substrate |
/ |
AlN |
BeO |
||
|
Thermal conductivity |
W/(m·K) |
＞200 |
＞230 |
＞250 |
|
|
Roughness |
μm |
＜0.3 |
＜0.3 |
＜0.3 |
|
|
CTE |
40 ~ 400 ℃ |
×10-6/K |
4.6 |
4.6 |
6.8 |
|
40 ~ 800 ℃ |
×10-6/K |
5.2 |
5.2 |
8.4 |
|
|
Thickness |
mm |
0.25 ~ 1.5 ± 10% |
|||
Keywords:
AlN semiconductor submount
Get a quote
Note: Please provide your email address, and our specialists will contact you as soon as possible!
Phone Number: 86+510-81190332
Email: sales@trusee.com
Company Website: www.trusee.com
Company Address: 1st Floor, Building 28, B-zone GLPI-Park, No.15 Hanjiang Rd, Wuxi,Jiangsu,P.R.China，214135
Mobile
Copyright © TRUSEE TECHNOLOGIES