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Metallized ceramic substrate

AlN semiconductor submount

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AlN semiconductor submount

Trusee can provides ceramic heat sink with high thermal conductivity, to provide solutions for heat dissipation of high power semiconductor laser diode, electrode connection, solder preset and assembly positioning.

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Substrate		/	AlN		BeO
Thermal conductivity		W/(m·K)	＞200	＞230	＞250
Roughness		μm	＜0.3	＜0.3	＜0.3
CTE	40 ~ 400 ℃	×10^-6/K	4.6	4.6	6.8
CTE	40 ~ 800 ℃	×10^-6/K	5.2	5.2	8.4
Thickness		mm	0.25 ~ 1.5 ± 10%

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